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iPhone 11 Pro Max material cost exposure: only 27.5% of the price, the largest increase in camera cost

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Editor’s Note: This article is from the WeChat public account “Crystal Intelligence” (ID: icsmart), the author of the core of the wisdom of the Rider sword, 36 氪 authorized to release.Following the dismantling of Apple’s iPhone 11 Pro Max by iFixit, a foreign professional dismantling agency, another foreign analyst, Techinsights, recently dismantled Apple’s iPhone 11 Pro Max.The main components were analyzed and the overall BOM cost was analyzed.According to Techinsights’ analysis, the total BOM cost of the iPhone 11 Pro Max (512GB version) is $490.5 (rounded to the nearest $0.50), which is about RMB 3,493, which is only 27.5% of its national version of the price of 12,699 yuan.It can be seen that the cost of the rear three-camera module of the iPhone 11 Pro Max is the highest in the total, reaching about 15%, which is $73.5.Followed by display and touch screen ($66.5) and A13 processor ($64).The previous iPhone Xs Max (256GB version) has a BOM cost of about $453, and the iPhone 11 Pro Max (512GB version) has increased by $57.5.Among the costs of the iPhone Xs Max, the screen costs the most, at $90.5, followed by the A12 RF/baseband ($72), the flash chip (256GB) for $64.5, and the camera cost of just $44.▲ iPhone Xs Max (256GB version) BOM cost In other words, the new iPhone 11 Pro Max has seen a significant drop in screen and storage costs, but the cost of the camera, processor + baseband has increased significantly.In particular, the cost of the camera has increased significantly by $29.5.The Apple A13 processor inside the iPhone 11 Pro Max, which was disassembled by Apple A13 processor Techinsights, is numbered APL1W85.The A13 processor and the Samsung K3UH5H50AM-SGCL 4GB LPDDR4X SDRAM package are packaged in PoP, which has the same 4GB DRAM capacity as the previous iPhone Xs Max.It is worth mentioning that the iFixit disassembled iPhone 11 Pro Max is based on SK Hynix H9HKNNNCRMMVDR-NEH LPDDR4X memory chip.The size of the A13 processor (die seal edge) is 10.67mm x 9.23mm = 98.48 mm2, which is 18.27% larger than the previous A12.The Samsung K3UH5H50AM-SGCL 4GB LPDDR4X SDRAM has four identical 1y nm dies.Baseband As expected, Intel provided the baseband chip for the iPhone 11, numbered.Based on the PMB9960, it may be an XMM7660 modem.According to Intel’s previously published data, the XMM7660 is based on the 14nm process and is the sixth-generation LTE modem that meets 3GPP Release 14.It supports speeds of up to 1.6 Gbps in the downlink (Cat.19) and up to 150 Mbps in the uplink.In contrast, the previous iPhone Xs Max used the Intel PMB9955 XMM7560 modem, which supports up to 1 Gbps in the downlink (Cat.16) and up to 225 Mbps in the uplink (Cat.15)..Since Intel officially withdrew from the smartphone baseband chip business, this may be the last time we saw the Intel mobile chipset on the iPhone.Because Apple reconciled with Qualcomm at the beginning of this year and reached a new patent licensing agreement.In addition, in July this year, Apple also reached an agreement with Intel to acquire Intel’s baseband chip business for $1 billion.Therefore, next year’s new iPhone will be Qualcomm’s 5G baseband chip even if it is not Apple’s self-developed 5G baseband chip.RF related devices in RF devices, iFixit’s disassembly shows that the iPhone 11 Pro Max uses: Avago8100 medium/high band PAMiD module Skyworks 78221-17 low band PAMiD module Intel 5765 P10 A15 08B13 H1925 transceiver Skyworks78223-17 power amplifierQorvo 81013 packet tracking module Skyworks 13797-19 DRx module Techinsights disassembled the iPhone 11 Pro Max internal RF related devices exactly the same.Among them, Intel PMB5765 is an RF transceiver that can be used with Intel modems.Power Management IC In terms of power management IC, the iPhone 11 Pro Max has an Intel 6840 P10 409 H1924 baseband power management IC for baseband chips; Apple’s own main PMIC 343S00355 (APL1092) for A13 Bionic; Apple 338S00510, Apple 338S00510;Texas Instruments TPS61280 battery DC / DC converter; STMicroelectronics STB601; Texas Instruments SN2611A0 battery charger, Samsung S2DOS23 display power management and so on.▲ Intel6840 P10 409 H1924 baseband power management ICUWB (U1) chip It is worth mentioning that the iPhone 11 series also added a USI module, which may contain the Apple U1 chip.Apple said its newly designed U1 chip uses ultra-wideband technology to achieve spatial awareness, allowing the iPhone 11 Pro to pinpoint other Apple devices that are also equipped with U1.This is like adding another sensory power to the iPhone that will bring a lot of exciting new features.With the U1 chip and iOS 13, when you use the airdrop, just point your iPhone to someone else’s iPhone, the system will prioritize each other, allowing you to share files faster.It can be understood that the U1 chip is similar to the W1 chip and the H1 chip that Apple used on the AirPods wireless earphone. It is a chip that provides space perception and more precise positioning.Apple said that the first application to take advantage of this new chip is Apple’s AirDrop app.With the iOS 13.1 update coming on September 30th, AirDrop will be better with direction-oriented advice.You can point your iPhone to other people, and AirDrop will give priority to the device so you can share files faster.Apple also said it will launch more advanced applications based on this U1 chip in the coming months.The 512GB version of the iPhone 11 Pro Max, which is disassembled by the memory chip Techinsights, uses the Toshiba 512 GB NAND flash module.Wi-Fi / BT module The Wi-Fi/Bluetooth module of the iPhone 11 Pro Max is the Murata 339S00647. Techinsights speculates that it may be equipped with the Broadcom Wi-Fi 6 / BT 5.0 wireless combination IC BCM4375.NFC module NXP once again won an order for the Apple iPhone with the new SN200 NFC&SE module.The wireless charging chip wireless charging chip uses STMicroelectronics STPMB0 933ANH HQHQ96 170721G.This may also mean that Broadcom has lost orders for Apple’s iPhone wireless charging chip.Apple’s 18W charger and its four chips, the iPhone11Pro Max, come with the Apple 172018W USB-C power charger.The device is rated for 5V/3A or 9V/2A.The camera iPhone 11 Pro Max is equipped with a rear-mounted three-shot for the first time, consisting of a 12-megapixel wide-angle (f/1.8) lens + a 12-megapixel telephoto (f/2.2) lens + a 12-megapixel ultra-wide-angle (f/2.0) lens.4x optical zoom.The iPhone 11 Pro Max also integrates a Face ID based on 3D structured light and a 12 megapixel self-timer lens..

Techinsights said that Sony is still a supplier of four vision cameras for the iPhone 11 Pro Max.ST Microelectronics has been the supplier of infrared camera chips for the iPhone’s front-mounted optical modules for three consecutive years.▲ iPhone 11, iPhone 11 Pro Max camera details ▲ 12 MP rear wide-angle camera image sensor die photo (removed filter) ▲ 12 MP backward super wide-angle camera image sensor die photo (removed filter▲12 MP rear telephoto camera image sensor transmission die photo (removed filter) ▲ 12 MP front camera image sensor die photo (removed filter) ▲ 1.4 MP front infrared camera image sensor nakedThe photo audio IC Apple / Cirrus Logic 338S00509 audio codec and three Apple 338S00411 audio amplifiers.The other iPhone 11 Pro Max is also based on the ST Microelectronics ST33G1M2 MCU, the NXP CBTL1612A1 display port multiplexer, and the Cypress CYPD2104 USB Type-C port controller.Editor: Core Intelligence – Rang Kejian Source: https://www.techinsights.com/blog/apple-iphone-11-pro-max-teardownhttps://www.techinsights.com/blog/apple-iphone-Xs-max-teardown