Chip level disassembly iPhone 11 Pro Max, BOM list exposure


Editor’s Note: This article is from the WeChat public account “Semiconductor Industry Watch” (ID: icbank), author techinsights, 36 is authorized to release.We are always happy to see the new Apple iPhone, and this year’s iPhone 11 series is no exception.

This is the first time Apple has released an iPhone with three rear cameras.
The mysterious U1 chip appeared on the screen of the Apple conference, but no one on the stage mentioned it.
Moreover, we must not forget that Apple is replacing the 7000-class aluminum alloy body with 100% recycled aluminum – mainly for environmental protection.The iPhone 11 Pro Max in our hands is a dark green model with model A2161 and 512 GB of memory.The following annotated board image below the board shows the excellent design we have determined so far.Apple A13 Bionic The A13 Bionic has an Apple part number APL1W85.It uses the A13 application processor and the Samsung K3UH5H50AM-SGCL 4GB LPDDR4X SDRAM in a stacked package (PoP), which has the same 4GB DRAM capacity as the previous generation iPhone Xs Max introduced last year.Update: The die of the A13 Bionic APL1W85 is labeled TMKF47.The die size (die edge) is 10.67mm x 9.23mm = 98.48 mm2, which increases the die size by 18.27% compared to the previous A12.According to TechInsights, the Samsung K3UH5H50AM-SGCL 4GB LPDDR4X SDRAM has four identical 1y nm dies.Baseband is not expected, Intel provides a mobile chipset for the iPhone 11.The baseband processor is the Intel PMB9960, most likely the XMM7660 modem.According to Intel, the XMM7660 is its sixth-generation LTE modem that meets 3GPP Release 14.It supports downlinks up to 1.6 Gbps (Cat 19) and uplinks up to 150 Mbps.In contrast, the Apple iPhone Xs Max uses the Intel PMB9955 XMM7560 modem, which supports up to 1 Gbps in the downlink (Cat 16) and up to 225 Mbps in the uplink (Cat 15).Intel said the XMM7660 modem uses a 14 nm process node, the same as last year’s XMM7560 process node.This may be the last time we saw Intel’s mobile chipset on the iPhone, because Intel has officially withdrawn from the mobile business.This change is mixed, because we are now looking forward to seeing the possibilities of Apple-designed modems in the future.Anyway, we all hope that the Qualcomm modem will appear on the iPhone next year.Whether Apple will launch iPhone 4G and iPhone 5G next year, we will wait and see.The RF transceiver Intel PMB5765 is identified as an RF transceiver that can be used with an Intel modem.Power Management IC Intel PMB6840, Apple 343S00355 (APL1092), should be Apple’s own main PMIC for A13 Bionic, Apple 338S00510, Texas Instruments TPS61280 battery DC/DC converter, STMicroelectronics STB601, Texas Instruments SN2611A0 battery charger, Samsung S2DOS23 display power supplyManagement, etc.The USI module shown below the UWB (U1) chip is likely to contain the Apple U1 chip.Apple claims that its U1 chip uses UWB technology to increase spatial awareness, allowing the iPhone 11 Pro to understand its exact location relative to other nearby Apple devices with U1.We look forward to hearing more about the features and use cases of the Apple U1 chip.Moreover, with the hype of the home Internet of Things, we can imagine that TechInsights is not the only company interested in this chip.So far, we know that the unauthorized UWB transmission in the Apple iPhone has two different frequencies – 6.24 GHz and 8.2368 GHz.It is worth mentioning that the U1 chip can only communicate with other U1 chips.Therefore, we look forward to seeing more U1s in the upcoming Apple products.If Apple can add the U1 chip to the Apple Watch Series 5, it would be a very interesting thing.UWB and indoor tracking are not a new concept. Since the first iPhone was introduced, it has been put on Apple’s agenda.Other companies also have UWBs, such as the analysis of Estimote UWB Beacons TechInsights as early as January 2018.These beacons use the DecaWave UWB transceiver to pinpoint other beacons and tags.For more information on Estimote Beacon UWB and Estimote LTE Beacons, please see our different reports on these sections listed here.TechInsights previously completed a basic floor plan analysis of the Decawave DW1000 UWB Radio IC, one of the results of the IoT SoC subscription, covering Bluetooth, Wi-Fi, ZigBee, LTE-M/NB-IoT, LoRa, Sigfox, NFC,GNSS, UWB, etc.Flash is in our iPhone 11 Pro Max model, which has a Toshiba 512 GB NAND flash module.Wi-Fi / BT module Murata 339S00647.We suspect that the module will be equipped with the Broadcom Wi-Fi 6 / BT 5.0 wireless combination IC BCM4375?We will find out the answer.NFCNXP won again with the new SN200 NFC&SE module.Update: We found a new die in the NXP SN200 that is different from the SN100 used in iPhone Xs / Xs Max / XR last year.What surprised us with wireless charging was that we found a new STPMB0 chip.We think it’s very likely to be a wireless charging receiver IC, which also means that Broadcom lost the socket, just as the Broadcom design we saw on the previous Apple iPhone won.Cameras Our survey of iPhone 11 and iPhone 11 Pro Max cameras is underway, and we summarize their findings in Table 1.In the Apple Special Event in September, we heard about the 100% focus pixel of the iPhone wide-angle camera.We expect this to be consistent with full-chip dual-photodiode phase-detection autofocus (PDAF), but we initially found the camera to display a PDAF mode similar to the 2018 iPhone wide-angle camera.The ongoing analysis will determine if Apple is actually using the dual PD mode as implied by the 100% focus pixel.If it is true, this will be the first time we use the shield + dual PD PDAF.Unsurprisingly, Sony is still a supplier of four vision cameras for the iPhone 11 Pro Max.STMicroelectronics has used its global shutter infrared camera chip as a detector for the iPhone’s structured light-based FaceID system for three years.Table 1: iPhone 11, iPhone 11 Pro Max Camera preliminary survey results summary 12MP rear wide-angle camera image sensor die image (filter has been removed) 12 MP rear super wide-angle camera image sensor die image (filter has been removed) 12 MP rear telephoto camera image sensor die image (filter has been removed) 12MP front camera image sensor die image (filter has been removed) 1.4 MP front infrared camera image sensor die die picture audio ICApple/ Cirrus Logic 338S00509 audio codec and three 338S00411 audio amplifiers.Envelope tracker Qorvo QM81013 Envelope tracker IC (possibly).RF front-end Avago (Broadcom) AFEM-8100 front-end module, Skyworks SKY78221-17 front-end module, Skyworks SKY78223-17 front-end module, Skyworks SKY13797-19 PAM and other STMicroelectronics ST33G1M2 MCU, NXP CBTL1612A1 display port multiplexer, Cypress CYPD2104 USBType-C port controller.We will continue to analyze the Apple iPhone 11 Pro Max.Check the update again the next day..